Hypertac的新型瞬态滤波设计为客户有效节省空间，重量和成本

Hypertac的新型瞬态滤波设计为客户有效节省空间，重量和成本

Hypertac宣布在其伦敦制造基地推出技术先进的EMI滤波和瞬态保护设备。新设备专注于节省重量，空间和成本，通过将滤波组件和电子保护装置组合在其连接器内，将滤波组件和电子保护装置相结合，使客户在广泛的市场应用中能够保护其内部和外部设备免受电磁干扰/射频干扰和瞬态能量尖峰接口解决方案。

Hypertac has announced the introduction of a technologically advanced EMI Filtering and Transient Protection facility at its London manufacturing site. Focused on saving weight, space and cost, the new facility enables customers from a wide range of markets to protect their equipment, both internal and external, against EMI/RFI and transient energy spikes by combining filtering components and electronic protection devices within its connectors and interface solutions.

Hypertac在实际连接器中包括电磁干扰滤波和瞬态保护装置的能力消除了对额外部件和PCB组件的需求。这节省了BOMs，设计和制造时间，同时通过减少布线和降低组件数量，提高了设备的可靠性及相关性能。

Hypertac’s ability to include EMI filters and transient protection devices within the actual connector obviates the need for extra components and PCB assemblies. This saves on BOMs, design and manufacturing time whilst enhancing reliability and performance due to reduced wiring and lower component count.

静电释放保护的滤波装置洁净室提供完整功能和处理过程:包括PCB组装和构建;焊接（PCB，触点，电缆，部件）;复杂电缆组件;保护涂层;子组件和连接器构建; ATE和手动测试;灌封和固化;组件筛选和刻录能力。

The ESD protected filter assembly clean room offers a complete range of capabilities and processes. embracing PCB assembly and build; soldering (PCB;contact;cable;components)complex cable assembly; conformal coating; sub assembly and connector build; ATE and manual testing; potting and curing; component screening and burn in capabilities.

新设备结合Hypertac电磁干扰滤波相关知识，使业务能够在接收到信号类型和数据速率时和推荐佳滤波器样式（例如C，LC和Pi）和值（高达1 microFarad）。它可以提供考虑实际源和负载阻抗的插入损耗模拟/预测，并验证整个频率范围内的插入损耗性能。可以提供符合RTCA D160F波形和电平规格的瞬态保护。

The new facility, together with Hypertac’s EMI filter knowledge, enables the business to specify and recommend optimum filter styles (e.g. C, LC and Pi) and values (up to 1microFarad) on receipt of signal type and data rate. It can provide insertion loss simulations/prediction that account for actual source and load impedances and verify insertion loss performance across an entire frequency range. Transient protection in accordance with RTCA D160F waveform and level specifications can be provided.

可以包含抗干扰功能的连接器类型包括军事通讯型号（38999,5015,26500），矩形连接器（JN1123，Arinc 600，Arinc 404,83527），D型连接器（D-Sub 24308，Micro-D 83513），过滤器模块。

Connector types that can incorporate filtering include military circular (38999, 5015, 26500); rectangular (JN1123, Arinc 600, Arinc 404, 83527); D style (D-Sub 24308, Micro-D 83513); and feed through filter modules.

 在连接器中结合过滤和瞬态组件的能力需要详细了解陶瓷和金属相互作用。 Hypertac的设计方法采用兼容的连接技术，用于触点和陶瓷之间以及陶瓷和外壳之间的接口，从而形成了坚固的结构，可满足应用需求以及客户的组装过程（如焊接）。

The ability to incorporate filtering and transient components within connectors requires a detailed understanding of ceramic and metal interaction. Hypertac’s design approach uses compliant connection technology for interface between contacts and ceramic and between ceramic and shell, resulting in a robust construction that meets both the application need as well as the customers’assembly processes (e.g. soldering).

在苛刻和高可靠性应用中需要使用，全面验证和质量检测包括振动;机械冲击;密封水和颗粒进入;海平面和高度DWV;绝缘电阻;盐雾;接地电阻测试/壳体对壳导电性;耐用性;热震和循环;温度寿命;循环湿度;当前评级;和瞬态保护测试。

Where required for use in demanding and high reliability applications, full verification and quality testing covers vibration; mechanical shock; sealing against water and particle ingress; DWV at sea level and altitude; insulation resistance; salt spray; earth bond resistance testing/shell to shell conductivity; durability; thermal shock and cycling; temperature life; cyclic humidity; current de-rating; and transient protection testing.

Hypertac技术总监Bill Henderson表示：“过滤和瞬变设备是Hypertac的一大优势，为我们提供了竞争对手的优势，并为客户提供技术，节省了空间，重量和成本。将连接器中的过滤和瞬态抑制功能融入到一起，有助于我们更加灵敏响应客户需求，为客户提供更高附加值以及在市场上的竞争力。”

Bill Henderson, Technical Director at Hypertac said, “The filtering and transient facility is a great asset to Hypertac, giving us an edge over competitors and the ability to offer customers cutting edge technology that saves them space, weight and cost. Having the facility to incorporate filtering and transient suppression within the connector helps us to be even more responsive and reduce time to market for our customers, adding value and giving them a competitive advantage in their marketplace”.

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